IEC 63000:2016/AMD1:2022 Amendment 1 - Technical documentation for the assessment of electrical and electronic products with respect to the restriction of hazardous substances
€12.00
IEC 60286-3:2022 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
€389.00
IEC 63203-402-1:2022 Wearable electronic devices and technologies - Part 402-1: Performance measurement of fitness wearables - Test methods of glove-type motion sensors for measuring finger movements
€93.00
IEC 60286-2:2022 Packaging of components for automatic handling - Part 2: Tape packaging of components with unidirectional leads on continuous tapes
€302.00
IEC 63203-401-1:2023 Wearable electronic devices and technologies - Part 401-1: Devices and systems: functional elements - Evaluation method of the stretchable resistive strain sensor
€186.00
IEC 60938-2-1:2023 Fixed inductors for electromagnetic interference suppression - Part 2-1: Blank detail specification - Inductors for which safety tests are required
€133.00
IEC 63203-402-3:2024 Wearable electronic devices and technologies - Part 402-3: Performance measurement of fitness wearables - Test methods for the determination of the accuracy of heart rate
IEC 63203-402-2:2024 Wearable electronic devices and technologies - Part 402-2: Performance measurement of fitness wearables - Step counting
Acceleration Factors
€70.00
Configuration Management Requirements For Defense Contracts
€67.00
Programmes for reliability growth (IEC 61014:2003); German version EN 61014:2003.
€122.34
Measurement of the dimensions of a cylindrical component having two axial terminations (IEC 40/2072/CD:2010)
€84.58
Essais d'environnement - Partie 2-21 : essais - Essai U : robustesse des sorties et des dispositifs de fixation
€106.33
Essais d'environnement - Partie 2-58 : essais - Essai Td : méthodes d'essai de la soudabilité, de la résistance de la métallisation à la dissolution et de la résistance à la chaleur de soudage des composants pour montage en surface (CMS)
€82.00
Essais d'environnement et d'endurance - Méthodes d'essais pour les cartes à montage en surface de boîtiers de type matriciel FBGA, BGA, FLGA, LGA, SON, et QFN
