Base materials for printed circuits - Part 2: Specifications; specification No. 12: Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards (IEC 60249-2-12:1987 + A1:1989 + A2:1993); German version EN 60249-2-12:1994 + A2:1994.
€56.17
Base materials for printed circuits - Part 2: Specifications; specification No. 13: Flexible copper-clad polyimide film, general purpose grade (IEC 60249-2-13:1987 + A1:1993); German version EN 60249-2-13:1994 + A1:1994
Base materials for printed circuits - Part 2: Specifications; specification No. 14: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test), economic quality (IEC 60249-2-14:1988 + A2:1990 + A3:1993); German version EN 60249-2-14:1994 + A3:1994.
€63.27
Base materials for printed circuits - Part 2: Specifications; specification No. 15: Flexible copper-clad polyimide film, of defined flammability (IEC 60249-2-15:1987 + A1:1993); German version EN 60249-2-15:1994 + A1:1994
Printed circuits - Terms and definition (IEC 52/91(Sec)497/48:1994 and IEC 52/91(Sec)497A/48A:1994)
€190.65
IEC 61249-8-8: Materials for interconnection structures - Part 8: Generic specification for non conductive films and coatings; section 8: Sectional specification: Temporary polymer coatings (IEC 52(Sec)509:1994)
IEC 1249-8-7: Materials for interconnection structures - Part 8: Generic specification non conductive films and coatings; Section 1: Sectional specification - Marking legend inks (IEC 52/523/CDV:1994)
IEC 61249-8-1: Materials for interconnection structures - Part 8: Nonconductive films and coatings; section 1: Adhesive coated flexible polyester film (IEC 52/520/CD:1994)
€48.79
IEC 61249-8-2: Materials for interconnection structures - Part 8: Nonconductive films and coatings; section 2: Adhesive coated flexible polyimide film (IEC 52/521/CD:1994)
IEC 61249-8-3: Materials for interconnection structures - Part 8: Nonconductive films and coatings; section 3: Transfer adhesive film (IEC 52/522/CD:1994)
Product data representation and exchange - Printed circuit assembly product design (IEC 3(Sec)455:1993)
€315.42
IEC 61249-2-12: Materials for interconnection structures - Part 2: Sectional specification set for reinforced base materials, clad and unclad; section 12: Epoxide non woven aramid laminate of defined flammability (IEC 52/585/CD:1995)
€84.58
IEC 61249-2-13: Materials for interconnection structures - Part 2: Sectional specification set for reinforced base materials, clad and unclad; section 13: Cyanate ester non woven aramid laminate of defined flammability (IEC 52/586/CD:1995)
IEC 61189-2: Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (IEC 52/569/CD:1995)
€116.64
IEC 61189-2: Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (IEC 52/570/CD:1995)
