Semiconductor devices; additional dual-in-line packages, family 50G; dimensions; identical with IEC 47(Central Office)1152
€34.30
Semiconductor devices; outline family 100G for integrated circuits; identical with IEC 47(Central Office)1150
Mechanical structures for electronic equipment; metrical equipment practice, multiple pitch 25 mm; co-ordination dimensions
€48.79
Mechanical structure for electronic equipment; metrical equipment practice, multiple pitch 25 mm; co-ordination dimensions; adaptions for the equipment practice acc. to DIN 41494
Terms and definitions for electromechanical structures for electronic equipment
€41.78
Mechanical standardization of semiconductor devices - Part 6-7: General rules for the dimensions of P-VQFN (IEC 47D/483/CDV:2002); German version prEN 60191-6-7:2002
€69.91
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch land grid array (FLGA); Rectangular type (IEC 60191-6-12:2002); German version EN 60191-6-12:2002.
€105.42
Heat sinks for semiconductor power devices; measuring method for thermal resistance
€24.39
Case type 80 for semiconductor devices; main dimensions
Cases type 90 for semiconductor devices; main dimensions
Mechanical structures for electronic equipments; subracks and subunits, dimensions of type A
Standard Specification and Test Method for Evaluation of Glass-to-Metal Headers Used in Electron Devices
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Standard Specification for Dumet Wire for Glass-to-Metal Seal Applications
Terminology Relating to Measurements Taken on Thin, Reflecting Films
