Mechanical structures for electrical and electronic equipment. Outdoor enclosures Environmental requirements, tests safety aspects
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Modular order for the development of mechanical structures electrical and electronic equipment practices Generic standard
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Recommendations for shielded enclosures
Mechanical structures for electronic equipment. Dimensions of mechanical the 482,6 mm (19 in) series Adaptation dimensions subracks and chassis applicable with metric cabinets or racks in accordance IEC 60917-2-1
Modular order for the development of mechanical structures electronic equipment practices Sectional specification. Interface coordination dimensions 25 mm practice. Adaptation subracks or chassis applicable in cabinets racks accordance with IEC 60297-3-100 (19 in)
Instrument transformers Additional requirements for inductive voltage
Modular order for the development of mechanical structures electronic equipment practices Generic standard
€269.00
Modular order for the development of mechanical structures electronic equipment practices. Sectional specification. Interface co-ordination dimensions 25 mm practice
Modular order for the development of mechanical structures electronic equipment practices. Sectional specification. Interface co-ordination dimensions 25 mm practice Detail Dimensions cabinets and racks
Modular order for the development of mechanical structures electronic equipment practices. Sectional specification. Interface co-ordination dimensions 25 mm practice Detail Dimensions subracks, chassis, backplanes, front panels and plug-in units
Railway fixed equipment. Modular power supply units for systems for signalling equipment, telecommunications equipment and computer equipment. Rectifier cabinet. - Installations fixes ferroviaires
€82.00
Line Replaceable Integrated Electronics Chassis Standard
€27.50
Railway fixed equipment. Modular power supply units or systems for signalling equipment, tlecommunication equipment and computer equipment. Convector cabinet. - Installations fixes ferroviaires
€37.33
Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation (Withdrawn 2013)
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Mechanical structures for electronic equipment. Design guide. Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 series
