Committee F01 on Electronics

ASTM F1683-05e1

ASTM F1683-05e1

Superseded Historical

Standard Practice for Creasing or Bending a Membrane Switch, Membrane Switch Flex Tail Assembly or Membrane Switch Component

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ASTM F18-64(2006)

ASTM F18-64(2006)

Superseded Historical

Standard Specification and Test Method for Evaluation of Glass-to-Metal Headers Used in Electron Devices

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ASTM F44-95(2006)

ASTM F44-95(2006)

Superseded Historical

Standard Specification for Metallized Surfaces on Ceramic

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ASTM F487-88(2006)

ASTM F487-88(2006)

Superseded Historical

Standard Specification for Fine Aluminum-1% Silicon Wire for Semiconductor Lead-Bonding

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ASTM F458-06

ASTM F458-06

Superseded Historical

Standard Practice for Nondestructive Pull Testing of Wire Bonds

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ASTM F106-06

ASTM F106-06

Superseded Historical

Standard Specification for Brazing Filler Metals for Electron Devices

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ASTM F459-06

ASTM F459-06

Superseded Historical

Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds

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ASTM F584-06

ASTM F584-06

Superseded Historical

Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire

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ASTM F7-95(2006)

ASTM F7-95(2006)

Superseded Historical

Standard Specification for Aluminum Oxide Powder

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ASTM F1269-06

ASTM F1269-06

Superseded Historical

Test Methods for Destructive Shear Testing of Ball Bonds

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ASTM F16-67(2006)

ASTM F16-67(2006)

Superseded Historical

Standard Test Methods for Measuring Diameter or Thickness of Wire and Ribbon for Electronic Devices and Lamps

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ASTM F72-06

ASTM F72-06

Superseded Historical

Standard Specification for Gold Wire for Semiconductor Lead Bonding (Withdrawn 2015)

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ASTM F1892-04

ASTM F1892-04

Superseded Historical

Standard Guide for Ionizing Radiation (Total Dose) Effects Testing of Semiconductor Devices

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ASTM F19-64(2005)e1

ASTM F19-64(2005)e1

Superseded Historical

Standard Test Method for Tension and Vacuum Testing Metallized Ceramic Seals

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ASTM F96-77(2005)

ASTM F96-77(2005)

Superseded Historical

Standard Specification for Electronic Grade Alloys of Copper and Nickel in Wrought Forms

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