Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2019); German version EN IEC 60286-3:2019.
€145.14
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 91/1602/CDV:2019); German and English Version prEN IEC 61760-1:2019
€140.00
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide (IEC 91/1631/CD:2019); Text in German and English
€91.03
Adhesive bondings in electronic applications - Bonding strength at surfaces - Part 2: Shear test
€56.17
Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes (IEC 40/2746/CD:2020); Text in German and English
€48.79
Method for Identification of Metal Particulate Contamination Found in Electronic and Microelectronic Components and Systems Using the Ring Oven Technique, With Spot Tests (Withdrawn 1994)
This product is not for sale, please contact us for more information
Methods for Detection and Enumeration of Microbiological Contaminants in Water Used for Processing Electron and Microelectronic Devices (Withdrawn 1991)
General method to declare the use of critical raw materials in energy-related products
€316.00
Methods for providing information relating to material efficiency aspects of energy-related products
€269.00
General method for assessing the proportion of reused components in energy-related products
€165.00
IEEE/IEC International Standard for Signal and Test Definition
€201.00
BS EN IEC 63489 DB. Common data concepts for smart manufacturing
€23.00
IEEE Recommended Practice for Powering and Grounding Electronic Equipment
€229.00
IEEE Standard for Signal and Test Definition
€419.00
IEEE Guide for the Use of IEEE Std 1641, Standard for Signal and Test Definition
€107.00
