IEEE Standard Framework for Reliability Prediction of Hardware
€92.00
IEEE Guide for the Use of IEEE Std 1641, IEEE Standard for Signal and Test Definition
€310.00
General method for assessing the proportion of reused components in energy-related products; German version EN 45556:2019
€56.17
IEEE Guide for Common Format for Naming Intelligent Electronic Devices (COMDEV)
€65.00
Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-17 : règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs à montage en surface - Guide de conception pour les boîtiers empilés - Boîtiers matriciels à billes et à pas fins et boîtiers matriciels à zone de contact plate et à pas fins (P-PFBGA et P-PFLGA)
€106.33
Interoperability specifications and communication method for external power supplies used with computing and consumer electronics devices (IEC 63002:2021); English version EN IEC 63002:2021.
€140.00
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide (IEC 61760-2:2021); German version EN IEC 61760-2:2021.
€98.32
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 40/2845/CD:2021); Text in German and English
€167.66
Letter symbols to be used in electrical technology - Part 2: Telecommunications and electronics (IEC 60027-2:2019); German version EN IEC 60027-2:2019
€229.44
Adhesive bondings in electronic applications - Determination of thermal conductivity of materials for heat dissipation
€48.79
Packaging of components for automatic handling - Part 2: Tape packaging of components with unidirectional leads on continuous tapes (IEC 60286-2:2022); German version EN IEC 60286-2:2022.
€128.22
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2022); German version EN IEC 60286-3:2022.
Interoperability specifications and communication method for external power supplies used with computing and consumer electronics devices (IEC 100/3463/CDV:2020); English version prEN IEC 63002:2020
Adhesive bondings in electronic applications - Bonding strength at surfaces - Part 2: Shear test
Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering (IEC 61760-3:2021); German version EN IEC 61760-3:2021.
€116.64
