Superseded
Draft standard
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DIN 50003:2023-08
Adhesive bondings in electronic applications - Determination of thermal conductivity of materials for heat dissipation
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Summary
Klebungen in elektronischen Anwendungen - Bestimmung der Wärmeleitfähigkeit von Materialien zur Wärmeableitung
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 08/01/2023 |
| Page Count | 8 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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