Test methods for electrical materials, printed board and other interconnection structures assemblies materials structures. Moisture absorption after pressure vessel conditioning
€165.00
Printed electronics Materials. Insulator ink. Measurement methods of properties insulator inks and printed insulating layers
€269.00
BS IEC 62899-201-2. Printed electronics Part 201-2. Materials. Evaluation method of stretchable substrates
€23.00
Printed electronics Materials. Substrates. Measurement methods for properties of stretchable substrates
Printed electronics Materials. Conductive ink. Measurement methods for properties of stretchable printed layers (conductive and insulating)
Generic requirements for printed board assembly products manufacturing description data and transfer methodology
€404.00
Printed electronics Materials. Conductive ink
€316.00
Test methods for electrical materials, printed boards and other interconnection structures assemblies General test materials assemblies. Guidance board
Test methods for electrical materials, printed boards and other interconnection structures assemblies materials structures. Relative permittivity loss tangent (500 MHz to 10 GHz)
Printed electronics Equipment. Contact printing. Rigid master. Measurement method of plate master pattern dimension
Printed electronics Printability. Measurement of qualities. Pattern width
€193.00
Printed electronics Materials. Substrates
€355.00
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) defined flammability (vertical burning test), copper-clad lead-free assembly
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) defined flammability (vertical burning test), copper-clad lead-free assembly
Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m K) defined flammability (vertical burning test), copper-clad lead-free assembly
