31.180 : Printed circuits and boards

BS IEC 62899-202-6:2020

BS IEC 62899-202-6:2020

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Printed electronics Materials. Conductive ink. Measurement method for resistance changes under high temperature and humidity. conductive layer on a flexible substrate

€193.00

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BS EN 16602-70-60:2019

BS EN 16602-70-60:2019

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Space product assurance. Qualification and Procurement of printed circuit boards

€404.00

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BS EN IEC 61189-5-504:2020

BS EN IEC 61189-5-504:2020

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Test methods for electrical materials, printed board and other interconnection structures assemblies General test materials assemblies. Process ionic contamination testing (PICT)

€269.00

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BS IEC 62899-202-7:2021

BS IEC 62899-202-7:2021

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Printed electronics Materials. film. Measurement of peel strength for printed layer on flexible substrate by the 90° method

€193.00

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BS EN IEC 62496-2-5:2022

BS EN IEC 62496-2-5:2022

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Optical circuit boards. Basic test and measurement procedures Flexibility for flexible opto-electric circuits

€269.00

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BS EN IEC 61188-6-1:2021

BS EN IEC 61188-6-1:2021

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Circuit boards and circuit board assemblies. Design use Land pattern design. Generic requirements for land on

€316.00

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PD IEC TR 61189-5-506:2019

PD IEC TR 61189-5-506:2019

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Test methods for electrical materials, printed boards and other interconnection structures assemblies General test materials assemblies. An intercomparison evaluation to implement the use of fine-pitch surface insulation resistance (SIR) testing solder fluxes in accordance with IEC 61189-5-501

€269.00

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BS EN 61754-20-100:2012

BS EN 61754-20-100:2012

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Fibre optic interconnecting devices and passive components. connector interfaces Interface standard for LC connectors with protective housings related to IEC 61076-3-106

€269.00

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BS EN 61249-2-42:2010

BS EN 61249-2-42:2010

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Materials for printed boards and other interconnecting structures Reinforced base materials clad unclad. Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad lead-free assembly

€269.00

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BS EN 62496-3-1:2010

BS EN 62496-3-1:2010

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Optical circuit boards. Performance standard Flexible optical boards using unconnectorized glass fibres

€193.00

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BS EN 61249-2-13:1999

BS EN 61249-2-13:1999

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Materials for interconnection structures. Sectional specification set reinforced base materials, clad and unclad Cyanate ester non-woven aramid laminate of defined flammability, copper-clad

€193.00

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BS CECC 265001:1998

BS CECC 265001:1998

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Harmonized system of quality assessment for electronic components. Technology approval schedule. Film and hybrid integrated circuits

€316.00

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BS 123300:2001

BS 123300:2001

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System of quality assessment. Sectional specification. Rigid multilayer printed boards

€193.00

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BS 123200:2001

BS 123200:2001

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System of quality assessment. Sectional specification. Rigid double-sided printed boards with plated-through holes

€193.00

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BS 123100:2001

BS 123100:2001

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System of quality assessment. Sectional specification. Rigid single-sided and double-sided printed boards with plain holes

€165.00

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