Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2004); German version EN 60191-6:2004.
€122.34
Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used in integrated circuits (IEC 47/1797/CD:2004)
€69.91
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 47D/607A/CD:2005)
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top type socket for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) (IEC 47D/620/CDV:2005); German version prEN 60191-6-13:2005
€84.58
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor test and burn-in socket for BGA, LGA, FBGA and FLGA (IEC 47D/621/CDV:2005); German version prEN 60191-6-16:2005
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 1: Climatic, mechanical tests and safety aspects for cabinets, racks and subracks (IEC 48D/325/CD:2005)
€105.42
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) (IEC 47D/763/CD:2010)
Quartz crystal controlled oscillators of assessed quality - Part 3: Standard outlines and lead connections (IEC 49/906/CD:2010)
€116.64
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals (IEC 47D/770/CD:2010)
Mechanical structures for electronic equipment - Part 3-107: Dimensions of subracks and plug-in units, micro format (IEC 48D/429/CD:2010)
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 47D/802/CD:2011)
€98.32
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 49/1028/CD:2013)
€41.78
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 47D/732/CD:2008)
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 47D/733/CD:2008)
€91.03
Piezoelectric filters of assessed quality - Part 3: Standard outlines and lead connections (IEC 49/838/CD:2009)
