Semiconductor devices, mechanical standardization - 3-leaded SMD outline package (Body size D × E: 1,60 mm × 0,8 mm) (IEC 47D/196/CD:1997)
€41.78
Semiconductor devices, mechanical standardization - Ceramic land grid array 1,0/0,8 mm pitch family (IEC 47D/197/CD:1997)
€48.79
Semiconductor devices, mechanical standardization - SON (Small Outline Non-Leaded Packages), 0,50 mm pitch family (IEC 47D/199/CD:1997)
Fin-pitch Ball-Grid-Array- and Land-Grid-Array 0,80 mm, 0,65 mm, 0,50 mm or 0,40 mm pitch family (IEC 47D/195/CD:1997)
€63.27
SVP-(Surface Vertical package), 0,65 mm pitch family (IEC 47D/198/CD:1997)
€111.40
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 4: Subracks and associated plug-in units; additional dimensions (IEC 48D/139/CDV:1997)
Detail specification for cabinets - Outdoor enclosures (IEC 48D/143/CD:1997)
€34.30
Detail specification for cases - Outdoor enclosures (IEC 48D/144/CD:1997)
IEC 60368-3: Piezoelectric filters - Part 3: Standard outlines (IEC 49/400/CD:1997)
€84.58
IEC 60679-3: Quartz crystal controlled oscillators - Part 3: Standard outlines and lead connections (IEC 49/401/CD:1997)
€116.64
Electromagnetic shielding performance tests for cabinets, racks and subracks (IEC 48D/151/CDV:1998)
€56.17
Semiconductor devices, mechanical standardization - QFP measuring method (IEC 47D/221/CDV:1998)
€91.03
Semiconductor devices, mechanical standardization - 4, 5 and 6 leaded SMD (Body size D × E: 2,0 mm × 1,25 mm) (IEC 47D/222/CD:1998)
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 3: Electromagnetic shielding performance tests for cabinets, racks and subracks (IEC 48D/310/CD:2004)
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-104: Connector dependent interface dimensions for subracks and plug-in units (IEC 48D/304/CD:2004)
