Quartz crystal controlled oscillators - Part 3: standard outlines and lead connections; Identical with IEC 60679-3:1989 (status as of 1991).
€111.40
Semiconductor devices, mechanical standardization; inclusion of three packages for power modules in IEC 191-2 (IEC 47D(Secretariat)7:1993)
€48.79
Semiconductor devices; mechanical standardization; designation system for semiconductor outlines (IEC 47D(Secretariat)5:1993)
€91.03
Semiconductor devices, mechanical standardization; transistor outline of form E; supplement to IEC 60191-2 (IEC 47D(Secretariat)13:1993)
Semiconductor devices; blank detail specification for field effect transistors for case-rated switching applications (IEC 47(Central Office)1350:1993)
Semiconductor devices; mechanical standardization; proposal for DAMBAR protusion and intrusion at terminals (IEC 47D(Secretariat)14:1993)
€41.78
Semiconductor devices, mechanical standardization; proposal for addition of a dual in line package with 56 terminals to the outline family 101G (IEC 47(Secretariat)1137:1991)
Dimensions of mechanical structures of the 482,6 mm (19in) series - Part 3: Subracks and associated plug-in units (IEC 60297-3:1984 + A1:1992); German version HD 493.3 S2:1993.
Mechanical standardization; terminal spacing for flat packages of integrated circuits
€34.30
Revision of appendix D of IEC publication 60191-3A: design procedure for dimensions of integrated circuit packages of form 2 family
Design rules for the dimensioning of form E; surface mounted dual in line; packages with bent leads
Mechanical standardisation; dimensions of integrated circuits outlines
Mechanical standardization; outline drawing for semiconductor laser diode devices to be included in IEC publication 60191-2
Outlines for semiconductor devices and integrated circuits; outline 5L3 and 5Q3 (IEC: A62B and A62E)
Outlines for semiconductor devices and integrated circuits; outlines 18F3 and 18G3 (IEC: A63D and A63E)
