Semiconductor devices, mechanical standardization; Amendment 2 to IEC 60191-2 (IEC 47D/58/CDV:1995)
€41.78
Semiconductor devices, mechanical standardization - IEC 60191-3: Requirements for pin 1 mark function and location adding PLCC figure 19 and QFP figure 20 (IEC 47D/72/CD:1995)
Semiconductor devices, mechanical standardization - Proposal for a definition of pin 1 orientation for TAB-packages (intended for inclusion into IEC 60191-3) (IEC 47D/73/CD:1995)
Mechanical aspects/climatic tests for cabinets, racks and subracks (IEC 48D/89/CD:1995)
€91.03
Seismic tests for cabinets and racks (IEC 48D/90/CD:1995)
€48.79
Electromagnetic shielding performance tests for cabinets, racks and subracks (IEC 48D/91/CD:1995)
€56.17
Semiconductor devices - Essential ratings and characteristics of TO-can laser devices (IEC 47C/99/CD:1995)
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 4: Subracks and associated plug-in units - Additional dimensions (IEC 60297-4:1995); German version EN 60297-4:1995.
€77.20
Semiconductor devices, mechanical standardization - Wire-ended diode package (small signal diode) (modification of A54) and power package outline (IEC 47D/81/CD:1995)
Semiconductor devices, mechanical standardization - Pin 1 mark and lead-numbering convention for dual-in-line packages with standard and reverse-bendlead form (IEC 47D/82/CD:1995)
Standard outlines of surface mounted devices (SMD) for frequency control and selection (IEC 49/338/CD:1996)
€122.34
Semiconductor devices, mechanical standardization - Proposal for a plastic small outline package J-lead (P-SOJ), 7,62 mm body-family (IEC 47D/104/CD:1996)
Semiconductor devices, mechanical standardization - Proposal for a plastic small outline package J-lead (P-SOJ), 10,16 mm body-family (IEC 47D/105/CD:1996)
Semiconductor devices, mechanical standardization - Proposal for a heat sink small outline (HSOP) family, similar to SOP family 075E contained in IEC 191-2 (IEC 47D/112/CD:1996)
Semiconductor devices, mechanical standardization - Proposal for a plastic thin small package P-TSOP II, 7,62 mm body family (if approved to be included in IEC 60191-2) (IEC 47D/113/CD:1996)
