31.240 : Mechanical structures for electronic equipment

DIN EN 60297-3-106:2011-01

DIN EN 60297-3-106:2011-01

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Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-106: Adaptation dimensions for subracks and chassis applicable with metric cabinets or racks in accordance with IEC 60917-2-1 (IEC 60297-3-106:2010); German version EN 60297-3-106:2010

€98.32

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DIN EN 60917-2-4:2011-01

DIN EN 60917-2-4:2011-01

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Modular order for the development of mechanical structures for electronic equipment practices - Part 2-4: Sectional specification - Interface coordination dimensions for the 25 mm equipment practice - Adaptation dimensions for subracks or chassis applicable in cabinets or racks in accordance with IEC 60297-3-100 (19 in) (IEC 60917-2-4:2010); German version EN 60917-2-4:2010

€91.03

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PR NF EN IEC 60297-3-102, C93-464-3-102PR (08/2025)

PR NF EN IEC 60297-3-102, C93-464-3-102PR (08/2025)

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Structures mécaniques pour équipements électroniques - Dimensions des structures mécaniques de la série 482,6 mm (19 pouces) - Partie 3-102: Poignée d'injecteur/d'extracteur

€80.50

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IEC 60917-2:1992

IEC 60917-2:1992

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IEC 60917-2:1992 Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice

€133.00

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IEC 60297-3-110:2018

IEC 60297-3-110:2018

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IEC 60297-3-110:2018 Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-110: Residential racks and cabinets for smart houses

€133.00

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IEC 61191-1:2018

IEC 61191-1:2018

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IEC 61191-1:2018 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

€342.00

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PR NF EN IEC 61587-1/A1 (10/2025)

PR NF EN IEC 61587-1/A1 (10/2025)

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Amendement 1 - Structures mécaniques pour les équipements électriques et électroniques - Essais pour les séries IEC 60917 et IEC 60297 - Partie 1 : Exigences environnementales, montages d'essai et aspects liés à la sécurité

€27.50

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NF EN 60917-2-3, C93-441-2-3 (11/2013)

NF EN 60917-2-3, C93-441-2-3 (11/2013)

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Ordre modulaire pour le développement des structures mécaniques pour les infrastructures électroniques - Partie 2-3 : spécification intermédiaire - Dimensions de coordination pour les interfaces des infrastructures au pas de 25 mm - Spécification particulière étendue - Dimensions pour bacs, châssis, fonds de panier, faces avant et unités enfichables

€131.33

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PR NF EN IEC 60297-3-101, C93-464-3-101PR (02/2151)

PR NF EN IEC 60297-3-101, C93-464-3-101PR (02/2151)

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Structures mécaniques pour équipements électriques et électroniques - Dimensions des structures mécaniques de la série 482,6 mm (19 pouces) - Partie 3-101: Bacs et blocs enfichables associés

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DIN EN IEC 60917-1:2022-10

DIN EN IEC 60917-1:2022-10

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Modular order for the development of mechanical structures for electrical and electronic equipment practices - Part 1: Generic standard (IEC 60917-1:2019); German version EN IEC 60917-1:2019.

€122.34

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DIN EN IEC 60286-3:2022-07

DIN EN IEC 60286-3:2022-07

Superseded Historical

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 40/2845/CD:2021); Text in German and English

€167.66

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DIN EN IEC 60749-39:2023-10

DIN EN IEC 60749-39:2023-10

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Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2021); German version EN IEC 60749-39:2022.

€91.03

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DIN EN IEC 60286-3:2023-11

DIN EN IEC 60286-3:2023-11

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Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2022); German version EN IEC 60286-3:2022.

€167.66

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DIN EN IEC 61837-2:2021-06

DIN EN IEC 61837-2:2021-06

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Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2018 + A1:2020); German version EN IEC 61837-2:2018 + A1:2020.

€261.78

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DIN EN IEC 60749-39:2021-07

DIN EN IEC 60749-39:2021-07

Superseded Historical

Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 47/2652/CDV:2020); English version prEN IEC 60749-39:2020

€63.27

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