Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 5: Guideline of cooling performance evaluation for indoor cabinets (IEC 48D/558/CD:2014)
€84.58
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009.
€140.00
Piezoelectric devices - Preparation of outline drawings of surface mounted devices (SMD) for frequency control and selection - General rules (IEC 49/894/CD:2009)
€98.32
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010 + Cor. :2010); German version EN 60191-6-18:2010
€105.42
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (IEC 60191-6-19:2010); German version EN 60191-6-19:2010
€91.03
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 47D/769/CD:2010)
€111.40
Mechanical structures for electronic equipment-Thermal management - Part 4: Cooling performance tests for water supplied heat exchangers in electronic cabinets (IEC 48D/453/CD:2010)
Mechanical structures for electronic equipment - Modular order for the development of mechanical structures for electronic equipment practices - Part 2-5: Cabinet interface dimensions for miscellaneous equipment (IEC 48D/454/CD:2010)
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 4: Combination of performance levels for modular cabinets (IEC 48D/458/CD:2010)
€69.91
Piezoelectric filters of assessed quality - Part 3: Standard outlines and lead connections (IEC 60368-3:2010); German version EN 60368-3:2010.
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011); German version EN 60191-6-17:2011
€116.64
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-100: Basic dimensions of front panels, subracks, chassis, racks and cabinets (IEC 60297-3-100:2008); German version EN 60297-3-100:2009.
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-105: Dimensions and design aspects for 1U high chassis (IEC 60297-3-105:2008); German version EN 60297-3-105:2009
Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 - Part 2: Design guide: Method for determination of forced air-cooling structure (IEC 48D/402/CD:2009)
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) (IEC 47D/755/CD:2009)
