Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series -- Part 5-103: Subracks and associated plug-in units - Electrostatic discharge protection.
€59.00
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series -- Part 5-104: Subracks and associated plug-in units - Keying.
€64.00
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series -- Part 5-107: Subracks and associated plug-in units - Rear mounted plug-in units.
€69.00
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 -- Part 1: Climatic, mechanical tests and safety aspects for cabinets, racks, subracks and chassis.
€73.00
Mechanical structures for electronic equipment - Outdoor enclosures -- Part 3: Sectional specification - Climatic, mechanical tests and safety aspects for cabinets and cases.
€50.00
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 -- Part 2: Seismic tests for cabinets and racks
MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT. DIMENSIONS OF MECHANICAL STRUCTURES OF THE 482,6 MM (19 IN) SERIES. PART 4: SUBRACKS AND ASSOCIATED PLUG-IN UNITS. ADDITIONAL DIMENSIONS.
€62.00
MODULAR ORDER FOR THE DEVELOPMENT OF MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT PRACTICES.
€26.00
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) (IEC 47D/834/CD:2013)
€105.42
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 47D/835/CD:2013)
€84.58
Quartz crystal controlled oscillators of assessed quality - Part 3: Standard outlines and lead connections (IEC 60679-3:2012); German version EN 60679-3:2013.
€111.40
Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 4: Cooling performance tests for water supplied heat exchangers in electronic cabinets (IEC 62610-4:2013); German version EN 62610-4:2013
€98.32
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013); German version EN 60191-4:2014.
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2011 + A1:2014); German version EN 61837-2:2011 + A1:2014.
€229.44
