Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 6: Air recirculation and bypass of indoor cabinets (IEC 62610-6:2020); German version EN IEC 62610-6:2020
€111.40
Mechanical structures for electrical and electronic equipment - Aisle containment for IT cabinets - Part 2: Details of air flow, air separation and air cooling requirements (IEC 62966-2:2020); German version EN IEC 62966-2:2020
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 61760-1:2020); German version EN IEC 61760-1:2020.
€145.14
Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes (IEC 60286-1:2017 + A1:2021); German version EN 60286-1:2017 + A1:2021.
€98.32
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2018); German version EN IEC 61837-2:2018.
€261.78
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018); German version EN 60191-4:2014 + A1:2018.
€128.22
Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 2: Method for the determination of forced air cooling (IEC 62610-2:2018); German version EN IEC 62610-2:2018
€105.42
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2019); German version EN IEC 60286-3:2019.
Semiconductor devices; metal cases with ceramic insulation, requirements and tests
€24.39
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 49/1338/CDV:2020); German and English version EN IEC 61837-2:2018/prA1:2020
€116.64
Packaging of components for automatic handling - Part 1: Tape packaging of components with axial leads on continuous tapes (IEC 40/2746/CD:2020); Text in German and English
€48.79
IEEE Guide for the Characterization of the Shielding Effectiveness of Planar Materials
€76.00
Mechanical structures for electrical and electronic equipment - Aisle containment for IT cabinets - Part 1: Dimensions and mechanical requirements (IEC 62966-1:2019); German version EN IEC 62966-1:2019
Semiconductor devices, mechanical standardization - Devices with terminals disposed in three or more rows in each orthogonal direction (IEC 47D(Sec)31:1994)
€41.78
Semiconductor devices, mechanical standardization - Plastic shrink small outline package (SSOP), 5,3 mm body width, 0,65 mm pitch, 1,25 mm lead length (IEC 47D(Sec)36:1994)
