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DIN IEC 47D(Sec)36:1995-02
Semiconductor devices, mechanical standardization - Plastic shrink small outline package (SSOP), 5,3 mm body width, 0,65 mm pitch, 1,25 mm lead length (IEC 47D(Sec)36:1994)
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Summary
Halbleiterbauelemente, mechanische Normung - SSOP-Gehäuse 5,3 mm Gehäusebreite, 0,65 mm Raster, 1,25 mm Anschlußlänge (IEC 47D(Sec)36:1994)
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 02/01/1995 |
| Page Count | 8 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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