31.240 : Mechanical structures for electronic equipment

DIN IEC 47D/114/CD:1996-08

DIN IEC 47D/114/CD:1996-08

Withdrawn Most Recent

Semiconductor devices, mechanical standardization - Proposal for a plastic small outline package P-TSOP II, 10,16 mm body family (intended for inclusion into IEC 60191-2) (IEC 47D/114/CD:1996)

€56.17

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DIN IEC 47D/106/CDV:1996-09

DIN IEC 47D/106/CDV:1996-09

Withdrawn Most Recent

Semiconductor devices, mechanical standardization - Plastic Ball Grid Array Outline Family (PBGA) (IEC 47D/106/CDV:1996)

€56.17

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DIN IEC 47D/108/CD:1996-09

DIN IEC 47D/108/CD:1996-09

Withdrawn Most Recent

Semiconductor devices, mechanical standardization - Plastic Shrink Small Outline Package (SSOP), 1,00 mm lead length, outline family, R-PDSO-G (IEC 47D/108/CD:1996)

€56.17

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DIN IEC 47D/109/CD:1996-09

DIN IEC 47D/109/CD:1996-09

Withdrawn Most Recent

Semiconductor devices, mechanical standardization - Plastic Thin Shrink Small Outline Package (TSSOP/HTSSOP), 1,00 mm lead length, outline family, R-PDSO-G (IEC 47D/109/CD:1996)

€63.27

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DIN IEC 47D/131/CD:1996-11

DIN IEC 47D/131/CD:1996-11

Superseded Historical

Semiconductor devices, mechanical standardization - Proposal for a Glass sealed ceramic Qaud Flat Package (G-QFP) family (IEC 47D/131/CD:1996)

€63.27

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DIN IEC 47D/145/CDV:1997-01

DIN IEC 47D/145/CDV:1997-01

Withdrawn Most Recent

Semiconductor devices, mechanical standardization - Tape ball grid array outline package (TBGA) family (IEC 47D/145/CDV:1996)

€41.78

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DIN IEC 47D/147/CD:1997-02

DIN IEC 47D/147/CD:1997-02

Withdrawn Most Recent

Semiconductor devices, mechanical standardization - Proposed addition to the metric plastic quad flatpack family 1,0 - 133E, 0,80 - 134E und 0,65 - 135E (Intended for inclusion into IEC 60191-2) (IEC 47D/147/CD:1996)

€91.03

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DIN IEC 47D/148/CD:1997-02

DIN IEC 47D/148/CD:1997-02

Withdrawn Most Recent

Semiconductor devices, mechanical standardization - Proposed new plastic quad flatpack outline, 1,0 and 1,4 mm thick body families (Intended for inclusion into IEC 191-2) (IEC 47D/148/CD:1996)

€98.32

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DIN IEC 48D/119/CD:1997-06

DIN IEC 48D/119/CD:1997-06

Superseded Historical

Dimensions of mechanical structures of the 482,6 mm (19in) series - Part 5: Subracks and associated plug-in for EMC, ESD, injector/extractor and keying (IEC 48D/119/CD:1997)

€91.03

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DIN 43350/A1:1992-08

DIN 43350/A1:1992-08

Superseded Historical

Terms and definitions for electromechanical structures for electronic equipment; amendment 1

€34.30

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DIN IEC 60191-4:1992-08

DIN IEC 60191-4:1992-08

Superseded Historical

Semiconductor devices; coding system for packages and classification into forms of package outlines; identical with IEC 60191-4:1987

€41.78

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DIN IEC 47(Sec)1281:1992-12

DIN IEC 47(Sec)1281:1992-12

Withdrawn Most Recent

Semiconductor devices; single ended package outline of form A; identical with IEC 47(Secretariat)1281

€41.78

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DIN IEC 47(CO)1305:1992-12

DIN IEC 47(CO)1305:1992-12

Withdrawn Most Recent

Semiconductor devices - Blank detail specification for reverse blocking triode thyristors, ambient and case-rated, for currents greater than 100 A; identical with IEC 47(Central Office)1305

€69.91

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DIN IEC 49(Sec)234:1993-01

DIN IEC 49(Sec)234:1993-01

Superseded Historical

General rules for the preparation of outline drawings of Surface Mounting Devices (SMD) for frequency control and selection; identical with IEC 49(Secretariat)234

€48.79

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DIN IEC 47D(Sec)1:1993-03

DIN IEC 47D(Sec)1:1993-03

Withdrawn Most Recent

Semiconductor devices, mechanical standardization; proposal for a SMD-diode outline; identical with IEC 47D(Secretariat)1

€41.78

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