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DIN IEC 47D/108/CD:1996-09

Semiconductor devices, mechanical standardization - Plastic Shrink Small Outline Package (SSOP), 1,00 mm lead length, outline family, R-PDSO-G (IEC 47D/108/CD:1996)

Summary

Halbleiterbauelemente, mechanische Normung - Plastic Shrink Small-Gehäuse (SSOP) 1,00 mm Anschlußlänge, Gehäusefamilie, R-PDSO-G (IEC 47D/108/CD:1996)

Technical characteristics

Publisher Deutsche Institut für Normung e.V. (DIN)
Publication Date 09/01/1996
Page Count 8
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Weight (in grams) ---
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