Withdrawn
Draft standard
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DIN IEC 47D/148/CD:1997-02
Semiconductor devices, mechanical standardization - Proposed new plastic quad flatpack outline, 1,0 and 1,4 mm thick body families (Intended for inclusion into IEC 191-2) (IEC 47D/148/CD:1996)
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Summary
Halbleiterbauelemente, mechanische Normung - Vorschlag eines neuen Plastik-QFP-Gehäuses, 1,0 und 1,4 mm dicke Gehäusefamilie (vorgesehen zur Aufnahme in IEC 191-2) (IEC 47D/148/CD:1996)
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 02/01/1997 |
| Page Count | 8 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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