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DIN EN 60191-6-17:2011-09
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (IEC 60191-6-17:2011); German version EN 60191-6-17:2011
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Summary
This part Series DIN EN 60191-6 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA and FLGA.
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 09/01/2011 |
| Page Count | 29 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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