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DIN IEC 60191-6-5:2010-01
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA) (IEC 47D/755/CD:2009)
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Summary
This part of IEC 60191 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array (hereinafter called FBGA), wohose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.
Notes
Prévu pour remplacer DIN EN 60191-6-5 (2002-05).
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 01/01/2010 |
| Cancellation Date | 01/01/2015 |
| Page Count | 38 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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01/01/2010
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