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DIN EN 60191-6-19:2010-10
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (IEC 60191-6-19:2010); German version EN 60191-6-19:2010
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Summary
This part of DIN EN 60191 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array (BGA), Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA).
Technical characteristics
| Publisher | Deutsche Institut für Normung e.V. (DIN) |
| Publication Date | 10/01/2010 |
| Page Count | 15 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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