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21/30439434 DC:2021
BS EN IEC 63215-5. Endurance test methods for die attach materials Part 5. Temperature cycling (system soldering interconnection) applied to module type power electronic devices
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Summary
Electronic equipment and components;Semiconductors;Joining processes;Testing;Test methods
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 12/03/2021 |
| Page Count | 16 |
| Themes | Test methods |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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