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21/30441791 DC:2021
BS EN IEC 61189-2-809. Test methods for electrical materials, printed board and other interconnection structures assemblies Part 2-809. X/Y Coefficient of Thermal Expansion (CTE) Thick Base Materials by TMA
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Summary
Materials by form;Printed-wiring boards;Printing board;Boards;Board (paper)
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 07/30/2021 |
| Page Count | 10 |
| Themes | Board (paper) |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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