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22/30443234 DC:2022
BS EN 63378-3. Thermal standardization on semiconductor packages Part 3. circuit simulation models of for transient analysis
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Summary
Semiconductor manufacture;Semiconductor materials;Semiconductor technology;Protection (thermal);Resistance (thermal);Stability (thermal);Thermal measuring;Thermal diffusion
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 01/24/2022 |
| Page Count | 19 |
| Themes | Thermal diffusion |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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