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23/30480992 DC:2023
BS EN IEC 60068-2-83. Environmental testing Part 2-83. Tests. Test Tf. Solderability of electronic omponents for surface mounting devices (SMD) by the wetting balance method using solder paste
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Summary
Pastes;Specimen preparation;Solders;Electrical components;Electronic equipment and components;Test equipment;Environmental testing;Solderability testing;Wettability;Testing conditions;Electric terminals;Electrical equipment;Surface mounting devices
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 10/06/2023 |
| Page Count | 37 |
| Themes | Surface mounting devices |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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