Withdrawn
Standard
Most Recent
ASTM F677-13
Standard Test Method for Fluid and Grease Resistance of Thermoset Encapsulating Compounds Used in Electronic and Microelectronic Applications (Withdrawn 2013)
Summary
1.1 This test method determines the resistance of encapsulating compounds to fluids or greases by measuring changes in weight (Note 1) and volume under defined conditions of time and temperature.
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. See 9.1.
Significance and Use:
5.1 Fluids and greases in contact with encapsulating compounds have the potential to adversely modify the encapsulant properties with resulting damage or loss of protection to components in electronic applications.
Technical characteristics
| Publisher | American Society for Testing and Materials (ASTM International) |
| Publication Date | 04/01/2013 |
| Cancellation Date | 12/06/2013 |
| Collection | |
| Page Count | 3 |
| Themes | Electronic components in general |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
Replaces
01/03/2004
Superseded
, Reaffirmed
Historical
Previous versions
01/03/2004
Superseded
, Reaffirmed
Historical
01/01/1995
Superseded
, Reaffirmed
Historical