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BS 3934-5:1997
Mechanical standardization of semiconductor devices Recommendations applying to tape automated bonding (TAB) integrated circuits
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Summary
Dimensional tolerances;Tape;Films (states of matter);Perforations;Mechanical behaviour of materials;Datum;Mechanical properties of materials;Dimensions;Standardization;Codes;Bonding;Electronic equipment and components;Holes;Electrical connections;Flexible materials;Integrated circuits;Semiconductor devices
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 09/15/1997 |
| Page Count | 38 |
| Themes | Semiconductor devices |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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