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BS CECC 23600-801:1998
Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections
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Summary
Conformity;Approval testing;Electronic equipment and components;Detail specification;Porosity measurement;Electrical components;Organic coatings;Electrical testing;Designations;Metal coatings;Edge socket connectors;Finishes;Preferred sizes;Solderability testing;Assessed quality;Electrical equipment;Laminates;Dimensional measurement;Inspection;Visual inspection (testing);Quality assurance systems;Surface treatment;Specification (approval);Thickness;Electrical insulation;Printed circuits;Holes;Printed-circuit boards;Defects;Mechanical testing;Multiple;Contaminants;Acceptance (approval);Ageing tests;Bonding;Resistance measurement;Specimen preparation;Capability approval
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 06/15/1998 |
| Page Count | 24 |
| Themes | Capability approval |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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