BS EN 60191-6-19:2010
Active Standard
Most Recent

BS EN 60191-6-19:2010

Mechanical standardization of semiconductor devices Measurement methods the package warpage at elevated temperature and maximum permissible

Summary

Standardization;Electronic equipment and components;Thermal testing;Concave;Heating tests;Surface mounting devices;Semiconductor devices;Convex;Curved;Integrated circuits;Dimensional measurement;Dimensions;Technical data sheets

Technical characteristics

Publisher British Standards Institution (BSI)
Publication Date 06/30/2010
Page Count 18
Themes Technical data sheets
EAN ---
ISBN ---
Weight (in grams) ---
No products.

Previous versions

Contact us