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BS EN 60749-14:2003
Semiconductor devices. Mechanical and climatic test methods Robustness of terminations (lead integrity)
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Summary
Testing conditions;Semiconductor devices;Torque;Qualification approval;Electronic equipment and components;Mechanical testing;Fatigue testing;Destructive testing;Tensile testing;Interfaces;Defects;Bend testing;Environmental testing;Climate;Semiconductors;Integrated circuits
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 12/15/2003 |
| Page Count | 18 |
| Themes | Integrated circuits |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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