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BS EN 60749-22:2003
Semiconductor devices. Mechanical and climatic test methods Bond strength
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Summary
Climate;Bonding;Electronic equipment and components;Environmental testing;Mechanical testing;Integrated circuits;Strength of materials;Semiconductor devices
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 07/04/2003 |
| Page Count | 24 |
| Themes | Semiconductor devices |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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04/07/2003
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