BS EN 61191-3:2017
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BS EN 61191-3:2017

Printed board assemblies Sectional specification. Requirements for through-hole mount soldered

Summary

Printed-circuit boards;Electrical components;Joints;Printed circuits;Soldering;Holes;Wires;Boards;Microassembling;Electrical equipment;Defects;Surface properties;Electronic equipment and components;Integrated circuits;Semiconductor devices

Technical characteristics

Publisher British Standards Institution (BSI)
Publication Date 09/25/2017
Page Count 26
Themes Semiconductor devices
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Weight (in grams) ---
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