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BS EN 61191-6:2010
Printed board assemblies Evaluation criteria for voids in soldered joints of BGA and LGA measurement methods
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Summary
Holes;Printed circuits;Measurement;Microassembling;Integrated circuits;Electronic equipment and components;Printed-circuit boards;Surface mounting devices;Soldering;Soldered joints
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 05/31/2010 |
| Page Count | 42 |
| Themes | Soldered joints |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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