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BS EN 61249-5-1:1996
Materials for interconnection structures. Sectional specification set conductive foils and films with without coatings Copper (for the manufacture of copper-clad base materials)
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Summary
Purity;Holes;Classification systems;Films (states of matter);Printed circuits;Thickness;Mass;Printed-circuit boards;Tensile strength;Electrical conductivity;Coatings;Packaging;Flexible materials;Printed-circuit bases;Laminates;Surface properties;Grades (quality);Designations;Dimensional tolerances;Copper;Marking;Foil;Electrical testing;Metal coatings;Elongation at fracture;Dimensions;Electrical resistivity;Surface treatment
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 09/15/1996 |
| Page Count | 18 |
| Themes | Surface treatment |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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