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BS EN 62047-12:2011
Semiconductor devices. Micro-electromechanical devices Bending fatigue testing method of thin film materials using resonant vibration MEMS structures
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Summary
Semiconductor devices;Test equipment;Vibration;Bend testing;Fatigue testing;Integrated circuits;Electromechanical devices;Test specimens;Thin-film devices;Semiconductor technology;Resonance;Electronic equipment and components
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 11/30/2011 |
| Page Count | 34 |
| Themes | Electronic equipment and components |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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