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BS EN 62047-13:2012
Semiconductor devices. Micro-electromechanical devices Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
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Summary
Semiconductor devices;Semiconductor technology;Electromechanical devices;Test equipment;Resonance;Integrated circuits;Bend testing;Test specimens;Fatigue testing;Electronic equipment and components;Thin-film devices;Vibration
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 05/31/2012 |
| Page Count | 18 |
| Themes | Vibration |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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