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BS EN 62047-15:2015
Semiconductor devices. Micro-electromechanical devices Test method of bonding strength between PDMS and glass
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Summary
Thin films;Electronic equipment and components;Test specimens;Electromechanical devices;Axial stress;Semiconductor technology;Test equipment;Tensile testing;Semiconductor devices
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 07/31/2015 |
| Page Count | 18 |
| Themes | Semiconductor devices |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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