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BS EN 62047-18:2013
Semiconductor devices. Micro-electromechanical devices Bend testing methods of thin film materials
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Summary
Semiconductor technology;Bend testing;Test specimens;Test equipment;Resonance;Integrated circuits;Semiconductor devices;Fatigue testing;Thin-film devices;Electromechanical devices;Vibration;Electronic equipment and components
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 10/31/2013 |
| Page Count | 18 |
| Themes | Electronic equipment and components |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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31/10/2013
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