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BS EN 62047-25:2016
Semiconductor devices. Micro-electromechanical devices Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength micro bonding area
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Summary
Semiconductor technology;Integrated circuits;Electronic equipment and components;Resonance;Electromechanical devices;Thin-film devices;Bend testing;Vibration;Test specimens;Fatigue testing;Test equipment;Semiconductor devices
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 11/30/2016 |
| Page Count | 28 |
| Themes | Semiconductor devices |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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