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BS EN 62047-26:2016
Semiconductor devices. Micro-electromechanical devices Description and measurement methods for micro trench needle structures
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Summary
Thin films;Semiconductor devices;Test equipment;Electronic equipment and components;Test specimens;Integrated circuits;Tensile testing;Semiconductor technology;Electromechanical devices
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 05/31/2016 |
| Page Count | 34 |
| Themes | Electromechanical devices |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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