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BS EN 62047-9:2011
Semiconductor devices. Micro-electromechanical devices Wafer to wafer bonding strength measurement for MEMS
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Summary
Semiconductor devices;Bonding;Tensile testing;Substrates (insulating);Electrostatics;Electronic equipment and components;Electromechanical devices;Bend testing;Shear testing;Visual inspection (testing);Adhesive strength;Integrated circuits;Semiconductor technology;Adhesion tests
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 01/31/2013 |
| Page Count | 30 |
| Themes | Adhesion tests |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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