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BS EN IEC 63378-3:2025
Thermal standardization on semiconductor packages circuit simulation models of discrete for transient analysis
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Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 06/24/2025 |
| Page Count | 20 |
| Themes | Thermal diffusion |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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