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BS IEC 62047-27:2017
Semiconductor devices. Micro-electromechanical devices Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
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Summary
Resonance;Vibration;Semiconductor devices;Thin-film devices;Semiconductor technology;Fatigue testing;Electromechanical devices;Integrated circuits;Test specimens;Electronic equipment and components;Test equipment;Bend testing
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 07/22/2020 |
| Page Count | 20 |
| Themes | Bend testing |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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