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BS IEC 62047-31:2019
Semiconductor devices. Micro-electromechanical devices Four-point bending test method for interfacial adhesion energy of layered MEMS materials
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Summary
CD-ROM;Data layout;Data transfer;Digital signals;Recording characteristics;Optical properties of materials;Coding (data conversion);Information exchange;Recording tracks;Data transmission;Error correction;Data processing;Environment (working);Read-only storage;Dimensions;Data media;Computer storage devices;Data recording;Optical disks;Storage;Testing conditions;Optical recording;Defects
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 04/17/2019 |
| Page Count | 16 |
| Themes | Defects |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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