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BS IEC 62047-35:2019
Semiconductor devices. Micro-electromechanical devices Test method of electrical characteristics under bending deformation for flexible electromechanical
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Summary
Semiconductor technology;Electromechanical devices;Deformation;Test methods;Semiconductor devices
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 04/20/2021 |
| Page Count | 24 |
| Themes | Semiconductor devices |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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