Active
Standard
Most Recent
BS IEC 62047-38:2021
Semiconductor devices. Micro-electromechanical devices Test method for adhesion strength of metal powder paste in MEMS interconnection
Preview
Summary
Vocabulary;Electromechanical devices;Integrated circuits;Terminology;Electronic equipment and components;Semiconductor technology;Semiconductor devices
Technical characteristics
| Publisher | British Standards Institution (BSI) |
| Publication Date | 07/07/2021 |
| Page Count | 16 |
| Themes | Semiconductor devices |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
No products.